Solder suction mechanical GS-134B (white and blue)

Product Description

Mechanical pump
It is used to remove solder when sealing components from printed circuit boards.
The soldering point is heated by the soldering iron tip until the solder melts, then the solder is removed by suction.
Periodically requires disassembly to clean solder residues and piston lubrication.
The tip is teflon, heat-resistant.

Specifications:
tip diameter internal: 2.5 mm
outer tip diameter: 5 mm
tip length: 14 mm
Desoldering pump length: 190 mm
diameter of the tin extractor: 19.5 mm
cylinder material: aluminum
case material: plastic
tip material: teflon