TIAN MU Silicone Thermal Conductive Adhesive, Room Temperature Curing
€12.00
TIAN MU Silicone Thermal Conductive Adhesive is a single-component, room temperature curing glue designed for efficient heat transfer in electronic applications.
It provides excellent thermal conductivity and is suitable for bonding heat sinks to various components.
This TIAN MU thermal conductive silicone adhesive is a high-performance, single-component compound that cures at room temperature. It is specifically formulated to improve heat transfer between electronic components and their heat sinks, ensuring optimal thermal management and extended device lifespan.
- Type: Silicone Thermal Conductive Adhesive
- Curing: Single-component, Room Temperature Curing
- Application: Electronic components, heat sinks, LEDs, power modules, CPUs, GPUs.
- Properties: High thermal conductivity, non-corrosive, good adhesion.
Ideal for use in various electronic assemblies where efficient heat dissipation is critical.
G429,F427
1 Item
New
TIAN MU Silicone Thermal Conductive Adhesive is a single-component, room temperature curing glue designed for efficient heat transfer in electronic applications.
It provides excellent thermal conductivity and is suitable for bonding heat sinks to various components.